ACM Research Launches New Furnace Tool for Thermal Atomic


FREMONT, Calif., Sept. 27, 2022 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a number one provider of wafer processing options for semiconductor and superior wafer-level packaging (WLP) functions, in the present day introduced that it has expanded its 300mm Ultra Fn furnace dry processing platform with the introduction of its Ultra Fn A furnace instrument. The Ultra Fn A system provides thermal atomic layer deposition (ALD) to ACM’s in depth listing of supported furnace functions. The firm additionally introduced that it has shipped the primary Ultra Fn A furnace instrument to a top-tier China-based foundry producer. The product is predicted to be certified in 2023.

“As logic nodes continue to shrink, customers are increasingly looking for suppliers that are willing to collaborate to meet their advanced process requirements, like ALD,” mentioned David Wang, CEO and president of ACM. “ALD is one of the fastest growing applications for manufacturing at advanced nodes, making it a critical new capability for our furnace portfolio. ACM’s deep understanding of the entire semiconductor manufacturing process and our innovative capabilities allow us to quickly develop new applications – wet and dry – to meet emerging market requirements. Our new ALD tool builds on our extensive furnace platform, which also includes support for atmospheric, low-pressure and ultra-high vacuum furnace options.”

About ACM’s Ultra Fn A Furnace Tool
ACM’s new thermal ALD instrument deposits each silicon nitride (SiN) and silicon carbide nitride (SiCN) movies. The preliminary Ultra Fn A instrument is predicted for use to fabricate the facet wall spacer layer in a 28nm logic manufacturing movement, a course of which calls for a really low etch price and good step protection. ACM’s Ultra Fn A furnace instrument with proprietary know-how has achieved an enchancment in uniformity in simulations as in contrast with aggressive approaches.

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ACM’s Ultra Fn A instrument builds on the success of ACM’s Ultra Fn furnace platform, which meets the dry processing challenges of LPCVD, oxidation, ultra-high vacuum anneal for alloy, excessive temperature and different widespread furnace processes. The Ultra Fn A furnace instrument was designed from the ground-up to fulfill best-in-class necessities for high-throughput batch ALD processing. It could be simply personalized with minor element and format modifications, which contributed to accelerated growth of recent forms of ALD processes. Its modern design additionally combines ACM’s confirmed software program know-how with new {hardware} that improves sturdiness and reliability, in addition to ACM’s proprietary process-control IP to offer speedy, steady course of management.

Learn extra concerning the Ultra Fn Furnace portfolio and supported functions.

About ACM Research, Inc.
ACM develops, manufactures and sells semiconductor course of gear for single-wafer or batch moist cleansing, electroplating, stress-free sharpening and thermal processes, that are vital to superior semiconductor machine manufacturing and wafer-level packaging. The firm is dedicated to delivering personalized, high-performance, cost-effective course of options that semiconductor producers can use in quite a few manufacturing steps to enhance productiveness and product yield. For extra data, go to

© ACM Research, Inc. The ACM Research emblem is a trademark of ACM Research, Inc. For comfort, this trademark seems on this press launch with out a ™ image, however that apply doesn’t imply that ACM won’t assert, to the fullest extent below relevant regulation, its rights to such trademark.

Media Contact: Company Contacts:
Jillian Carapella USA
Kiterocket Robert Metter
+1 646.402.2408 ACM Research, Inc. +1 503.367.9753
  Xi Wang
  ACM Research (Shanghai), Inc.
  +86 21 50808868
  YY Kim
  ACM Research (Korea), Inc.
  David Chang
  +886 921999884
  Adrian Ong
  +65 8813-1107
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