Tessolve (www.tessolve.com), the semiconductor trade’s main engineering answer supplier, has acquired Pico2Femto Semiconductor (P2fsemi), primarily centered on bodily design options.
P2fsemi’s acquisition considerably strengthens Tessolve’s ASIC design choices from RTL to GDSII signoff, with elevated full-turnkey backend design experience. Tessolve has pioneered a number of turnkey options, from design to testing packaged components, over the previous few years, evolving into the largest stand-alone semiconductor engineering answer supplier.
P2fsemi permits clients to get first-pass silicon success with their 100+ Physical Design consultants specialised in expertise nodes all the way down to 3nm. Its capabilities embrace hardening high-speed & advanced IPs and sophisticated low-power SOCs from top-level implementation to signoffs. P2fsemi will complement and deepen Tessolve’s current pre-silicon design options.
Balaji Prabhakar, CEO of P2fsemi, stated, “Both the companies share a common vision, and the merger brings significant opportunities for all the stakeholders, customers, and employees. As part of Tessolve, we will be able to deliver world-class engineering solutions to our new and larger global customer base, add value to existing customers and create more high-skilled engineering talent in the region.”
“P2fsemi team, with excellent Physical Design expertise in advanced process nodes, is a great addition to our strong engineering team delivering state-of-the-art Silicon Design solutions. As we march towards our vision of becoming the leading platform company for Silicon and Systems Design and Productization, we will continue to make key investments to be a value-add engineering partner to our customers. I welcome Balaji’s team to the Tessolve family!” commented Srini Chinamilli, CEO of Tessolve.
P2fsemi’s acquisition considerably strengthens Tessolve’s ASIC design choices from RTL to GDSII signoff, with elevated full-turnkey backend design experience. Tessolve has pioneered a number of turnkey options, from design to testing packaged components, over the previous few years, evolving into the largest stand-alone semiconductor engineering answer supplier.
P2fsemi permits clients to get first-pass silicon success with their 100+ Physical Design consultants specialised in expertise nodes all the way down to 3nm. Its capabilities embrace hardening high-speed & advanced IPs and sophisticated low-power SOCs from top-level implementation to signoffs. P2fsemi will complement and deepen Tessolve’s current pre-silicon design options.
Balaji Prabhakar, CEO of P2fsemi, stated, “Both the companies share a common vision, and the merger brings significant opportunities for all the stakeholders, customers, and employees. As part of Tessolve, we will be able to deliver world-class engineering solutions to our new and larger global customer base, add value to existing customers and create more high-skilled engineering talent in the region.”
“P2fsemi team, with excellent Physical Design expertise in advanced process nodes, is a great addition to our strong engineering team delivering state-of-the-art Silicon Design solutions. As we march towards our vision of becoming the leading platform company for Silicon and Systems Design and Productization, we will continue to make key investments to be a value-add engineering partner to our customers. I welcome Balaji’s team to the Tessolve family!” commented Srini Chinamilli, CEO of Tessolve.
Tessolve, with its latest development and acquisitions, has shortly established itself as a significant accomplice for silicon design companies. With individuals at the heart of its core values, Tessolve continues to allow buyer success whereas offering workers with alternatives to push expertise boundaries.
