SAN JOSE, Calif. and GUANGZHOU, China, Sept. 26, 2022 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corporation, the world’s quickest rising FPGA firm, publicizes right now the discharge of its new era Arora V excessive efficiency FPGA household using superior 22nm SRAM expertise and integrating 270Mbps-12.5Gbps excessive velocity SerDes interfaces, PCIe 2.1 onerous core with assist for PCIe x1, x2, x8 modes, together with MIPI onerous core single lane module at as much as 2.5Gbps, and DDR3 interfacing at speeds as much as 1333 Mbps. The first household gadget, GW5AT-138FC676, options 138K LUT logic assets, 6.4MB block RAM, 1.1MB distributed SRAM, together with superior DSP blocks, and built-in ADC. Future household units embrace 25K (non-Serdes) and 60K LUT units.
“This new generation Arora V family is an important milestone in GOWIN Semiconductor’s development,” stated Jason Zhu, CEO, GOWIN Semiconductor FPGA. “Having entered and now proliferated in the low and mid density FPGA market space, this family further enhances our leadership position and is based on genuine innovation with advanced development. As always, we remain oriented towards providing continuous support for our customer’s need of innovative solutions and true value.”
“The Arora V family integrates many innovative hard core modules that have been developed internally by GOWIN, including fully controllable high speed SerDes ideal for supporting applications requiring very high data rates such as communication, video aggregation, and AI computing acceleration. New architecture DSP modules, Block RAM modules supporting ECC error correction, high performance multiple voltage GPIO, and high accuracy clock architecture are all featured in Arora V,” stated TP Wang, Chief Technology Officer at GOWIN Semiconductor. “We imagine that these new era Arora V merchandise will present our prospects with larger efficiency and decrease energy consumption, whereas the internally optimized modules will present prospects with extra versatile configurations and a greater consumer expertise.”
In addition to advanced hardware design, Arora V integrates many new mainstream hard-core modules as well as soft IP solutions for various interfaces such as PCIe 2.1, MIPI DSI, DDR3, SGMII, XAUI, Gbe, SDI and USB3.1. “These free of charge IP solutions will effectively shorten customer’s time to market delivering additional value,” said Mike Furnival, Vice President of International Sales, GOWIN Semiconductor. “We genuinely believe the launch of Arora V will greatly expand the adoption of GOWIN based solutions in the mid to high density space resulting in further expansion for the development of the global FPGA industry.”
For more information about GOWIN, please visit www.gowinsemi.com.
About GOWIN Semiconductor Corp.
Founded in 2014, Gowin Semiconductor Corp., headquartered with major R&D in China, has the vision to accelerate customer innovation worldwide with our programmable solutions. We focus on optimizing our products and removing barriers for customers using programmable logic devices. Our commitment to technology and quality enables customers to reduce the total cost of ownership from using FPGA on their production boards. Our offerings include a broad portfolio of programmable logic devices, design software, intellectual property (IP) cores, reference designs, and development kits. We strive to serve customers in the consumer, industrial, communication, medical, and automotive markets worldwide.
Copyright 2022 GOWIN Semiconductor Corp. GOWIN, LittleBee®, GW1N/NR/NS/1NSR/1NZ®, Arora®, Arora V®, GW2A/AR®, GOWIN EDA and other designated brands included herein are trademarks of GOWIN Semiconductor Corp. in China and other countries. All other trademarks are the property of their respective owners. For more information, please email [email protected]
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