Aehr Receives Wafer Level Burn-in System Order from New

FREMONT, Calif., Sept. 13, 2022 (GLOBE NEWSWIRE) — Aehr Test Systems (NASDAQ: AEHR), a worldwide provider of semiconductor manufacturing check and reliability qualification tools, at present introduced it has acquired a purchase order order from a brand new buyer for a FOX-NP^TM multi-wafer check and burn-in system, a number of WaferPak^TM Contactors and a FOX WaferPak Aligner for use for qualification of Aehr’s wafer stage burn-in answer for silicon carbide gadgets for electrical autos and different markets. This firm is a serious provider of silicon carbide gadgets serving a number of important markets together with the electrical automobile business. This order has acceptance standards together with demonstrating sure new enhancements and performance standards supplied by Aehr and stipulated beneath a corresponding analysis and acceptance settlement. Upon profitable completion of the required standards, ultimate acceptance of the acquisition order is met, and title switch and invoicing will likely be accomplished.

This FOX system is configured for stress testing and burning in 150mm and 200mm silicon carbide wafers utilizing Aehr’s proprietary WaferPak full wafer Contactors. The FOX-NP system and FOX WaferPak Aligner are scheduled to ship this week to the shopper’s facility.

Gayn Erickson, President and CEO of Aehr Test Systems, commented, “We are very excited that this new customer has chosen to move forward with us after we demonstrated the capability and configurability of the FOX platform full wafer test and burn-in solution using our systems and their silicon carbide wafers at our facility in Fremont, California. This company has indicated to us that no other provider has a product that is scalable to high volume production like Aehr’s FOX-XP multi-wafer system. The FOX-NP system is a two-wafer system that is fully compatible with the volume production FOX-XP, which can be configured with up to nine or eighteen wafers depending on the customer’s specific test requirements and power configuration. This allows our customers to choose between larger and smaller configuration systems that are 100% compatible with each other at their facilities around the world. The purchase order for the FOX-NP system includes specific performance and functionality evaluation criteria that we believe Aehr will achieve on their test floor during the next three to six months which triggers final acceptance of the solution. They have provided us with forecasts for our FOX-XP systems for volume production of their silicon carbide devices at multiple facilities around the world, with initial delivery for our FOX-XP systems requested during this fiscal year ending May 31, 2023.

“Forecasts from Canaccord Genuity estimate that the silicon carbide market for devices in electric vehicles, such as traction inverters and the on-board chargers, is expected to grow from fewer than 150,000 wafers in 2021 to more than four million 6-inch equivalent wafers in 2030 to meet the demand of the automotive electric vehicle market, representing a growth rate of over 25 times the current wafer capacity just for the in-vehicle devices. Canaccord also estimates that the silicon carbide market will require an additional four million silicon carbide wafers annually by 2030 to meet demand for electrification infrastructure, industrial and photovoltaic power devices.

“The FOX family of compatible systems including the FOX-NP and FOX-XP multi-wafer test and burn in systems and Aehr’s proprietary WaferPak full wafer contactors provide a uniquely cost-effective solution for burning in multiple wafers of devices at a single time to remove early life failures of silicon carbide devices which is critical to meeting the initial quality and long-term reliability the automotive, industrial, and electrification infrastructure industry needs.”

The FOX-XP and FOX-NP programs, accessible with a number of WaferPak Contactors (full wafer check) or a number of DiePak^TM Carriers (singulated die/module check) configurations, are able to purposeful check and burn-in/biking of gadgets corresponding to silicon carbide and gallium nitride energy semiconductors, silicon photonics in addition to different optical gadgets, 2D and 3D sensors, flash recollections, magnetic sensors, microcontrollers, and different modern ICs in both wafer type issue, earlier than they’re assembled into single or multi-die stacked packages, or in singulated die or module type issue.

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide supplier of check programs for burning-in semiconductor gadgets in wafer stage, singulated die, and package deal half type, and has put in over 2,500 programs worldwide. Increased high quality and reliability wants of the Automotive and Mobility built-in circuit markets are driving further check necessities, incremental capability wants, and new alternatives for Aehr Test merchandise in package deal, wafer stage, and singulated die/module stage check. Aehr Test has developed and launched a number of modern merchandise, together with the ABTS^TM and FOX-P^TM households of check and burn-in programs and FOX WaferPak^TM Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The ABTS system is utilized in manufacturing and qualification testing of packaged components for each decrease energy and better energy logic gadgets in addition to all widespread varieties of reminiscence gadgets. The FOX-XP and FOX-NP programs are full wafer contact and singulated die/module check and burn-in programs used for burn-in and purposeful check of advanced gadgets, corresponding to modern silicon carbide-based energy semiconductors, recollections, digital sign processors, microprocessors, microcontrollers, systems-on-a-chip, and built-in optical gadgets. The FOX-CP system is a brand new low-cost single-wafer compact check and reliability verification answer for logic, reminiscence and photonic gadgets and the most recent addition to the FOX-P product household. The WaferPak Contactor accommodates a novel full wafer probe card able to testing wafers as much as 300mm that permits IC producers to carry out check and burn-in of full wafers on Aehr Test FOX programs. The DiePak Carrier is a reusable, momentary package deal that permits IC producers to carry out cost-effective ultimate check and burn-in of each naked die and modules. For extra info, please go to Aehr Test Systems’ web site at www.aehr.com.

Safe Harbor Statement
This press launch accommodates sure forward-looking statements inside the that means of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements usually relate to future occasions or Aehr’s future monetary or working efficiency. In some instances, you may determine forward-looking statements as a result of they include phrases corresponding to “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “might,” “intends,” “goal,” “tasks,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “proceed,” or the negative of these words or other similar terms or expressions that concern Aehr’s expectations, strategy, priorities, plans, or intentions. Forward-looking statements in this press release include, but are not limited to, future requirements and orders of Aehr’s new and existing customers; bookings forecasted for proprietary WaferPak^TM and DiePak consumables; and expectations related to long-term demand for Aehr’s productions and the attractiveness of key markets. The forward-looking statements contained in this press release are also subject to other risks and uncertainties, including those more fully described in Aehr’s recent Form 10-K, 10-Q and other reports filed from time to time with the Securities and Exchange Commission. Aehr disclaims any obligation to update information contained in any forward-looking statement to reflect events or circumstances occurring after the date of this press release.