Aehr Announces New Advanced Testing Capabilities on its

FREMONT, Calif., Oct. 06, 2022 (GLOBE NEWSWIRE) — Aehr Test Systems (NASDAQ: AEHR), a worldwide provider of semiconductor take a look at and reliability qualification gear, right this moment introduced it has launched two new enhancements for its FOX-P household of wafer degree take a look at and burn-in programs. These embrace the FOX™ Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) choices which allow new superior take a look at and burn-in capabilities for silicon-carbide and gallium-nitride energy semiconductors on Aehr’s FOX-P wafer-level take a look at and burn-in programs. Silicon Carbide energy units and modules are being extensively adopted within the drive prepare utilized in electrical automobiles in addition to onboard and offboard electrical automobile chargers. Gallium Nitride primarily based semiconductors are on the early phases of their software utilization, however are anticipated to develop considerably of their use in a variety of energy conversion purposes together with photovoltaic, industrial, and different electrification infrastructure purposes. The new superior wafer degree take a look at and burn-in capabilities enabled with the addition of the FOX-P BVCM and VHVCM choices permit silicon carbide and gallium nitride semiconductor producers extra flexibility to handle a greater variety of stress and burn-in circumstances to handle their engineering qualification and manufacturing wants in FOX-P multi-wafer take a look at and burn-in programs. These choices can be found with new system shipments or for upgrades of beforehand shipped FOX-P programs with first shipments deliberate with typical 12 – 16 week lead occasions.

The Bipolar Voltage Channel Module (BVCM), offers prospects a variety of bipolar voltage programmability from optimistic 40 volts to adverse 30 volts utilized to the gate for optimistic High Temperature Gate Bias (HTGB) or Negative HTGB testing. The BVCM can provide gate bias voltage to greater than 3,000 die per wafer whereas able to monitoring particular person die efficiency. The BVCM, together with Aehr’s proprietary WaferPak full-wafer Contactors, ship a singular functionality benefitting energy silicon carbide diodes and MOSFETs and each E-mode and D-mode gallium nitride energy MOSFET producers. Enabling these exams are significantly important in threshold voltage (V_TH) and gate oxide stabilization and screening.

The Very High Voltage Channel Module (VHVCM) permits prospects to carry out High Temperature Reverse Bias (HTRB) testing on wafers at as much as 2,000 volts on MOSFETs and diodes and measure particular person gadget leakage present. Aehr’s proprietary WaferPak™ Contactor implements arcing mitigation know-how to alleviate excessive voltage arcing on the wafer, particularly with wonderful pitch die-to-die geometries. A full wafer HTRB stress take a look at on silicon carbide or gallium nitride know-how may be utilized as much as 2,000 volts in a single landing.

The modularity of the FOX-P system presents prospects the flexibility to configure options to offer superior take a look at capabilities for his or her energy digital gadget wafers. These superior capabilities allow producers to ship product with larger reliability and parametric stability necessitated by electrical automobile’s traction inverters and on-board chargers. Test and burn-in at wafer degree ensures higher management of yield loss and improved product reliability. Ultimately, customers profit from larger reliability and decrease prices.

Gayn Erickson, President and CEO of Aehr Test Systems, commented, “Aehr has engaged with a significant number of silicon carbide and gallium nitride semiconductor suppliers from across the world, multiple power semiconductor experts from academia, as well as direct contact with automotive tier 1 module suppliers and automotive drive train and photovoltaic inverter manufacturers. Based on input from this wide range of manufacturers, module suppliers, and purchasers of these devices, we are extending our FOX-P wafer level test and burn-in platform to provide additional new engineering and production solutions featuring these options with up to 18 wafers to be tested in parallel at the same time. By testing and burning in the devices in wafer form, this significantly lowers the cost of test as well as allows these companies to weed out early life failures that otherwise would show up in packaged or even more costly in multi-chip module form.

“In addition to the obvious cost advantage of removing these device failures before they are put into a module with many other devices, companies also want to stabilize the inherent early life drift of the threshold voltages (Vth) observed in silicon carbide MOSFETs and then select devices with matching threshold voltages to be put in multi-chip modules. Feedback from current and a number of new potential customers has been very positive, and we have already taken orders for both systems and WaferPaks for these new options. This includes a new major silicon carbide customer announced last month, and another brand-new customer who just this week ordered WaferPaks for a planned FOX-P system purchase from us for their silicon carbide products. We expect these new enhancements to drive incremental bookings and revenue for our FOX-NP systems for new product introduction and engineering qualification needs as well as our FOX-XP multi-wafer systems to be used for high volume production with these new features.”

The FOX-XP, FOX-NP, and FOX-CP programs, obtainable with a number of WaferPak Contactors (full wafer take a look at) or a number of DiePak™ Carriers (singulated die/module take a look at) configurations, are able to useful take a look at and burn-in/biking of built-in units reminiscent of silicon carbide energy units, silicon photonics in addition to different optical units, 2D and 3D sensors, flash recollections, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and different modern ICs in both wafer type issue, earlier than they’re assembled into single or multi-die stacked packages, or in singulated die or module type issue.

About Aehr Test Systems
Headquartered in Fremont, California, Aehr Test Systems is a worldwide supplier of take a look at programs for burning-in semiconductor units in wafer degree, singulated die, and bundle half type, and has put in over 2,500 programs worldwide. Increased high quality and reliability wants of the Automotive and Mobility built-in circuit markets are driving extra take a look at necessities, incremental capability wants, and new alternatives for Aehr Test merchandise in bundle, wafer degree, and singulated die/module degree take a look at. Aehr Test has developed and launched a number of revolutionary merchandise, together with the ABTS™ and FOX-P™ households of take a look at and burn-in programs and FOX WaferPak™ Aligner, FOX WaferPak Contactor, FOX DiePak^® Carrier and FOX DiePak Loader. The ABTS system is utilized in manufacturing and qualification testing of packaged components for each decrease energy and better energy logic units in addition to all frequent sorts of reminiscence units. The FOX-XP and FOX-NP programs are full wafer contact and singulated die/module take a look at and burn-in programs used for burn-in and useful take a look at of complicated units, reminiscent of modern silicon carbide-based energy semiconductors, recollections, digital sign processors, microprocessors, microcontrollers, systems-on-a-chip, and built-in optical units. The FOX-CP system is a brand new low-cost single-wafer compact take a look at and reliability verification answer for logic, reminiscence and photonic units and the most recent addition to the FOX-P product household. The WaferPak Contactor incorporates a singular full wafer probe card able to testing wafers as much as 300mm that permits IC producers to carry out take a look at and burn-in of full wafers on Aehr Test FOX programs. The DiePak Carrier is a reusable, momentary bundle that permits IC producers to carry out cost-effective closing take a look at and burn-in of each naked die and modules. For extra info, please go to Aehr Test Systems’ web site at www.aehr.com.

Safe Harbor Statement
This press launch incorporates sure forward-looking statements inside the that means of Section 27A of the Securities Act of 1933 and Section 21E of the Securities Exchange Act of 1934. Forward-looking statements typically relate to future occasions or Aehr’s future monetary or working efficiency. In some circumstances, you’ll be able to establish forward-looking statements as a result of they include phrases reminiscent of “may,” “will,” “should,” “expects,” “plans,” “anticipates,” “going to,” “could,” “intends,” “target”, “projects,” “contemplates,” “believes,” “estimates,” “predicts,” “potential,” or “continue,” or the adverse of those phrases or different related phrases or expressions that concern Aehr’s expectations, technique, priorities, plans, or intentions. Forward-looking statements on this press launch embrace, however usually are not restricted to, future necessities and orders of Aehr’s new and current prospects; bookings forecasted for proprietary WaferPak™ and DiePak consumables; and expectations associated to long-term demand for Aehr’s productions and the attractiveness of key markets. The forward-looking statements contained on this press launch are additionally topic to different dangers and uncertainties, together with these extra totally described in Aehr’s current Form 10-Ok, 10-Q and different experiences filed sometimes with the Securities and Exchange Commission. Aehr disclaims any obligation to replace info contained in any forward-looking assertion to mirror occasions or circumstances occurring after the date of this press launch.